EVG Wafer Bonder (evbond)
Overview
The Electronic Visions system is comprised of the precision optical 620 Aligner and the 501 Wafer Bonder. The Bonder module includes a Megasonic Clean station for ultrasonic cleaning of wafers before alignment. Using the specially provided bond tool, wafers to be bonded are aligned on the 620 Aligner and then placed in the 501 Bonder for processing. Although primarily used for anodic bonding, the 501 Bonder is compatible with several other bonding modes, including: compression, direct Si-Si, low temperature eutectic/frit bonding. Our current configuration accommodates 100 mm round wafers and pieces.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Substrate Type
Substrate Sizes
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
SNF: Wafer Bonding, Sawing and Polishing
NEMO ID:
evbond
Training and Maintenance
Lab Facility:
Training Charges:
4.00 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Study the relevant operating procedures:
- Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Contact the primary trainer: Cliff Knollenberg
