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Silicon Oxide Wet Etching

Mixtures of diluted hydrofluoric acid are typically used to etch silicon oxides.

Technique Tabs

Main Tab

Processing Techniques	Equipment name & NEMO ID	Teaser Blurb	Cleanliness	Location
Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Clean_res-hf wbclean_res-hf	Semi-automated wet bench for etching oxide from 3", 4", and 6" Si, SiGe, and quartz substrates using 50:1 HF, 6:1BOE, or 20:1BOE. 2 baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.	Clean	SNF Cleanroom Paul G Allen L107
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Flexcorr 1 wbflexcorr-1	Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.	Flexible	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & NEMO ID	Cleanliness	Chemicals	Primary Materials Etched	Other Materials Etched	Substrate Size	Notes
Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Clean_res-hf wbclean_res-hf	Clean	20:1 BOE 50:1 HF 6:1 BOE	SiO₂		3" 4" 6"	Resist as mask allowed
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing	Wet Bench Flexcorr 1 wbflexcorr-1	Flexible	Acids Bases Gold Etchant 20:1 BOE 50:1 HF 6:1 BOE 9:1 Piranha Al-Etch Chrome Etch KOH SC1 SC2	Metals Al Au Cr Si SiO₂ Resist	GaAs Si3N4 Ti W	Pieces 2" 3" 4" 6"	Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.