Hydrogen peroxide mixtures are used for etching common CMOS metals like Al, Ti and W.
| Processing Techniques | Equipment name & NEMO ID | Teaser Blurb | Cleanliness | Location |
|---|---|---|---|---|
| Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing |
Wet Bench CMOS Metal wbclean3 |
Wet bench part of semiclean cleanliness group to etch Al, Ti, W, or silicon oxide from 3, 4, or 6 inch wafers. The tanks can hold up to 25 wafers. |
Semiclean | SNF Paul G Allen L107 Cleanroom |
| Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only. |
Flexible | SNF Paul G Allen L107 Cleanroom |