Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Location
CO2 Drying, Wet Chemical Processing Critical Point Dryer Tousimis Automegasamdri-936
cpd

Critical Point Drying (CPD) tool is used for carbon dioxide (CO2) drying after release of bulk or surface micromachined devices.

 Flexible SNF Paul G Allen L107 Cleanroom
Resist Develop (manual), Wet Chemical Processing Ex Fab Develop Wet Bench
wbexfab_dev

Manual developing of photoresist using mainly MF-26A.

 Flexible SNF Exfab Paul G Allen 104 Stinson
Solvent Cleaning, Metal Lift-off, Wet Chemical Processing Ex Fab Solvent Wet Bench
wbexfab_solv 		Flexible SNF Exfab Paul G Allen 104 Stinson
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing Wet Bench Clean 1
wbclean-1

Wet Bench Clean-1 and 2 is used for RCA cleaning 3", 4", and 6" silicon, silicon germanium, or quartz wafers which are in the 'clean' cleanliness group.

 Clean SNF Paul G Allen L107 Cleanroom
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing Wet Bench Clean 2
wbclean-2

Wet Bench Clean-1 and 2 is used for RCA cleaning 3", 4", and 6" silicon, silicon germanium, or quartz wafers which are in the 'clean' cleanliness group.

 Clean SNF Paul G Allen L107 Cleanroom
Silicon Nitride Wet Etching, Wet Chemical Processing Wet Bench Clean_res- hotphos
wbclean_res-hotphos

Semi-automated wet bench for etching silicon nitride from 3", 4", and 6" Si, SiGe, and quartz substrates using 155C phosphoric acid. The baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.

 Clean SNF Paul G Allen L107 Cleanroom
Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Clean_res-hf
wbclean_res-hf

Semi-automated wet bench for etching oxide from 3", 4", and 6" Si, SiGe, and quartz substrates using 50:1 HF, 6:1BOE, or 20:1BOE. 2 baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.

 Clean SNF Paul G Allen L107 Cleanroom
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Clean_res-piranha
wbclean_res-piranha

Wet Bench Clean_res-piranha is part of the 'clean' cleanliness group and is used to clean or remove resist from 3", 4", and 6" silicon, quartz, and silicon germanium wafers using piranha. 2 baths are available and can hold up to 25 wafers.

 Clean SNF Paul G Allen L107 Cleanroom
Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing Wet Bench CMOS Metal
wbclean3

Wet bench part of semiclean cleanliness group to etch Al, Ti, W, or silicon oxide from 3, 4, or 6 inch wafers. The tanks can hold up to 25 wafers.

 Semiclean SNF Paul G Allen L107 Cleanroom
Decontamination, Wet Chemical Processing Wet Bench Decontamination
wbdecon

Decontamination of  3" or 4" silicon, quartz, or silicon germanium wafers after KOH, wafersaw, or cmp using SC2 before being allowed back into the clean equipment group.

 Clean SNF Paul G Allen L107 Cleanroom
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1

Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.

 Flexible SNF Paul G Allen L107 Cleanroom
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 2
wbflexcorr-2

Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot pots available. GaAs allowed in personal labware only.

 Flexible SNF Paul G Allen L107 Cleanroom
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 3
wbflexcorr-3

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

 Flexible SNF Paul G Allen L107 Cleanroom
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 4
wbflexcorr-4

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.

 Flexible SNF Paul G Allen L107 Cleanroom
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 1
wbflexsolv-1

Manual solvent cleaning, two ultrasonic baths.

 Flexible SNF Paul G Allen L107 Cleanroom
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 2
wbflexsolv-2

Manual solvent cleaning and resist removal, hot plate.

 Flexible SNF Paul G Allen L107 Cleanroom
Resist Develop (manual), Wet Chemical Processing Wet Bench Miscellaneous
wbmiscres

Manual developing of photoresist using mainly AZ1:1 developer.

 Flexible SNF Paul G Allen L107 Cleanroom
Wet Resist Removal, Wet Chemical Processing Wet Bench Resist Strip
wbresstrip-1

Wet bench to remove resist using SRS-100 or PRS1000.

 Clean (Ge), Semiclean, Flexible SNF Paul G Allen L107 Cleanroom
Solvent Cleaning, Wet Chemical Processing Wet Bench Solvent Lithography
lithosolv

Manual solvent cleaning of materials in the flexible cleanliness group. Teflon coated metal tweezers cleaning. SU8 development.

 Flexible SNF Paul G Allen L107 Cleanroom