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Wet Chemical Processing

Technique Tabs

Main Tab
Processing Techniques Equipment name & NEMO ID Teaser Blurb Cleanliness Location
CO2 Drying, Wet Chemical Processing Critical Point Dryer Tousimis Automegasamdri-936
cpd

Critical Point Drying (CPD) tool is used for carbon dioxide (CO2) drying after release of bulk or surface micromachined devices.

Flexible SNF Cleanroom Paul G Allen L107
Resist Develop (manual), Wet Chemical Processing Ex Fab Develop Wet Bench
wbexfab_dev

Manual developing of photoresist using mainly MF-26A.

Flexible SNF Exfab Paul G Allen 104 Stinson
Solvent Cleaning, Metal Lift-off, Wet Chemical Processing Ex Fab Solvent Wet Bench
wbexfab_solv
Flexible SNF Exfab Paul G Allen 104 Stinson
Mask Cleaning (manual), Wet Chemical Processing Mask Scrubber
masksrub

Manual mask cleaner for one 5 inch mask, water under pressure.

All SNF Cleanroom Paul G Allen L107
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing Wet Bench Clean 1
wbclean-1

Wet Bench Clean-1 and 2 is used for RCA cleaning 3", 4", and 6" silicon, silicon germanium, or quartz wafers which are in the 'clean' cleanliness group.

Clean SNF Cleanroom Paul G Allen L107
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing Wet Bench Clean 2
wbclean-2

Wet Bench Clean-1 and 2 is used for RCA cleaning 3", 4", and 6" silicon, silicon germanium, or quartz wafers which are in the 'clean' cleanliness group.

Clean SNF Cleanroom Paul G Allen L107
Silicon Nitride Wet Etching, Wet Chemical Processing Wet Bench Clean_res- hotphos
wbclean_res-hotphos

Semi-automated wet bench for etching silicon nitride from 3", 4", and 6" Si, SiGe, and quartz substrates using 155C phosphoric acid. The baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.

Clean SNF Cleanroom Paul G Allen L107
Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Clean_res-hf
wbclean_res-hf

Semi-automated wet bench for etching oxide from 3", 4", and 6" Si, SiGe, and quartz substrates using 50:1 HF, 6:1BOE, or 20:1BOE. 2 baths can hold up to 25 wafers. Part of the Clean Cleanliness Group.

Clean SNF Cleanroom Paul G Allen L107
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Clean_res-piranha
wbclean_res-piranha

Wet Bench Clean_res-piranha is part of the 'clean' cleanliness group and is used to clean or remove resist from 3", 4", and 6" silicon, quartz, and silicon germanium wafers using piranha. 2 baths are available and can hold up to 25 wafers.

Clean SNF Cleanroom Paul G Allen L107
Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing Wet Bench CMOS Metal
wbclean3

Wet bench part of semiclean cleanliness group to etch Al, Ti, W, or silicon oxide from 3, 4, or 6 inch wafers. The tanks can hold up to 25 wafers.

Semiclean SNF Cleanroom Paul G Allen L107
Decontamination, Wet Chemical Processing Wet Bench Decontamination
wbdecon

Decontamination of  3" or 4" silicon, quartz, or silicon germanium wafers after KOH, wafersaw, or cmp using SC2 before being allowed back into the clean equipment group.

Clean SNF Cleanroom Paul G Allen L107
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1

Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only.

Flexible SNF Cleanroom Paul G Allen L107
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 2
wbflexcorr-2

Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot pots available. GaAs allowed in personal labware only.

Flexible SNF Cleanroom Paul G Allen L107
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 3
wbflexcorr-3

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

Flexible SNF Cleanroom Paul G Allen L107
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 4
wbflexcorr-4

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.

Flexible SNF Cleanroom Paul G Allen L107
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 1
wbflexsolv-1

Manual solvent cleaning, two ultrasonic baths.

Flexible SNF Cleanroom Paul G Allen L107
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 2
wbflexsolv-2

Manual solvent cleaning and resist removal, hot plate.

Flexible SNF Cleanroom Paul G Allen L107
Resist Develop (manual), Wet Chemical Processing Wet Bench Miscellaneous
wbmiscres

Manual developing of photoresist using mainly AZ1:1 developer.

Flexible SNF Cleanroom Paul G Allen L107
Wet Resist Removal, Wet Chemical Processing Wet Bench Resist Strip
wbresstrip-1

Wet bench to remove resist using SRS-100 or PRS1000.

Clean (Ge), Semiclean, Flexible SNF Cleanroom Paul G Allen L107
Solvent Cleaning, Wet Chemical Processing Wet Bench Solvent Lithography
lithosolv

Manual solvent cleaning of materials in the flexible cleanliness group. Teflon coated metal tweezers cleaning. SU8 development.

Flexible SNF Cleanroom Paul G Allen L107
Detail Tab
Processing Technique Equipment name & NEMO ID Cleanliness Chemicals Primary Materials Etched Other Materials Etched Substrate Size Maximum Load (number of wafers) Process Temperature Range Developer Mask Size Notes
CO2 Drying, Wet Chemical Processing Critical Point Dryer Tousimis Automegasamdri-936
cpd
Flexible

CO2 drying after release of micromachined devices

Resist Develop (manual), Wet Chemical Processing Ex Fab Develop Wet Bench
wbexfab_dev
Flexible

Manual development of resist in beakers. SNF approved developers only. No solvents!

Solvent Cleaning, Metal Lift-off, Wet Chemical Processing Ex Fab Solvent Wet Bench
wbexfab_solv
Flexible
Mask Cleaning (manual), Wet Chemical Processing Mask Scrubber
masksrub
All 5 inch

5 inch mask cleaning, water under pressure, no chemicals

Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing Wet Bench Clean 1
wbclean-1
Clean
25

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing Wet Bench Clean 2
wbclean-2
Clean
25

No resist allowed. Resist should have been removed at the wbclean_res-piranha

Silicon Nitride Wet Etching, Wet Chemical Processing Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Clean

Resist should have been removed

Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Clean_res-hf
wbclean_res-hf
Clean

Resist as mask allowed

Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Clean_res-piranha
wbclean_res-piranha
Clean

Resist will be removed

Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing Wet Bench CMOS Metal
wbclean3
Semiclean
25 wafers

Al, Ti, or W wet etching or oxide etching

Decontamination, Wet Chemical Processing Wet Bench Decontamination
wbdecon
Clean

KOH or wafersaw or post-cmp decontamination

Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1
Flexible

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 2
wbflexcorr-2
Flexible

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only

Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 3
wbflexcorr-3
Flexible

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 4
wbflexcorr-4
Flexible

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.

Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible

Manual solvent cleaning, two ultrasonic baths.

Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible

Manual solvent cleaning, hot plate

Resist Develop (manual), Wet Chemical Processing Wet Bench Miscellaneous
wbmiscres
Flexible

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Wet Resist Removal, Wet Chemical Processing Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible 25 4 inch wafers
20 °C - 60 °C

Wet Resist Removal: SRS-100 or PRS1000

Solvent Cleaning, Wet Chemical Processing Wet Bench Solvent Lithography
lithosolv
Flexible

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

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