Processing Technique Equipment name & NEMO ID Cleanliness Chemicals Primary Materials Etched Other Materials Etched Substrate Size Maximum Load (number of wafers) Process Temperature Range Developer Notes Stylus Tip Radius
CO2 Drying, Wet Chemical Processing Critical Point Dryer Tousimis Automegasamdri-936
cpd 		Flexible

CO2 drying after release of micromachined devices
Resist Develop (manual), Wet Chemical Processing Ex Fab Develop Wet Bench
wbexfab_dev 		Flexible

Manual development of resist in beakers. SNF approved developers only. No solvents!
Solvent Cleaning, Metal Lift-off, Wet Chemical Processing Ex Fab Solvent Wet Bench
wbexfab_solv 		Flexible
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing Wet Bench Clean 1
wbclean-1 		Clean
25

No resist allowed. Resist should have been removed at the wbclean_res-piranha.
Pre-Diffusion Clean, Pre-LPCVD or Pre-Metal Clean, Wet Chemical Processing Wet Bench Clean 2
wbclean-2 		Clean
25

No resist allowed. Resist should have been removed at the wbclean_res-piranha
Silicon Nitride Wet Etching, Wet Chemical Processing Wet Bench Clean_res- hotphos
wbclean_res-hotphos 		Clean

Resist should have been removed
Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Clean_res-hf
wbclean_res-hf 		Clean

Resist as mask allowed
Piranha Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Clean_res-piranha
wbclean_res-piranha 		Clean

Resist will be removed
Aluminum and Titanium and Tungsten Wet Etching, Wet Chemical Processing Wet Bench CMOS Metal
wbclean3 		Semiclean
25 wafers

Al, Ti, or W wet etching or oxide etching
Decontamination, Wet Chemical Processing Wet Bench Decontamination
wbdecon 		Clean

KOH or wafersaw or post-cmp decontamination
Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing Wet Bench Flexcorr 1
wbflexcorr-1 		Flexible

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 2
wbflexcorr-2 		Flexible

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 3
wbflexcorr-3 		Flexible

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.
Acid or Base Wet Etching, Piranha Cleaning, Wet Chemical Processing Wet Bench Flexcorr 4
wbflexcorr-4 		Flexible

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 1
wbflexsolv-1 		Flexible

Manual solvent cleaning, two ultrasonic baths.
Solvent Cleaning, Wet Resist Removal, Wet Chemical Processing Wet Bench Flexible Solvents 2
wbflexsolv-2 		Flexible

Manual solvent cleaning, hot plate
Resist Develop (manual), Wet Chemical Processing Wet Bench Miscellaneous
wbmiscres 		Flexible

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Wet Resist Removal, Wet Chemical Processing Wet Bench Resist Strip
wbresstrip-1 		Clean (Ge), Semiclean, Flexible
25 4 inch wafers
20 °C - 60 °C

Wet Resist Removal: SRS-100 or PRS1000
Solvent Cleaning, Wet Chemical Processing Wet Bench Solvent Lithography
lithosolv 		Flexible

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.