50:1 HF is typically used as an oxide etchant.
Equipment name & Badger ID | Training Required & Charges | Cleanliness | Location | Chemicals | Notes |
---|---|---|---|---|---|
Wet Bench Clean 1 wbclean-1 |
Wet Bench Clean1and2 Training 2.00 hours |
SNF Cleanroom Paul G Allen L107 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha. |
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Wet Bench Clean 2 wbclean-2 |
Wet Bench Clean1and2 Training 2.00 hours |
SNF Cleanroom Paul G Allen L107 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha |
||
Wet Bench Clean_res-hf wbclean_res-hf |
Wet Bench Clean Piranha/HF/Phosphoric Training 2.25 hours |
SNF Cleanroom Paul G Allen L107 |
Resist as mask allowed |
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Wet Bench CMOS Metal wbclean3 |
Wet Bench CMOS Metal (wbclean3) Training | SNF Cleanroom Paul G Allen L107 |
Al, Ti, or W wet etching or oxide etching |
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Wet Bench Flexcorr 1 wbflexcorr-1 |
Wet Bench Flexcorr 1and2 and 3and4 Training 2.00 hours |
SNF Cleanroom Paul G Allen L107 |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |