Wet Bench CMOS Metal (wbclean3)
Overview
This part of the bench (right side) is the Wet Bench CMOS Metal (wbclean3). It replaces some parts of the former wbmetal bench for processing of silicon wafers with standard metals, part of the "semiclean" cleanliness group. This station has one room temperature bath for peroxide solutions, one aluminum etch hot pot, two HF tanks for oxide etching, one contains 50:1 HF, and the second tank contains either 6:1 or 20:1 BOE, and one dump rinser. The SRD on the left side of this bench is used for both sides.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Chemicals
Substrate Type
Substrate Sizes
Maximum Load:
25 wafers
Notes:
Al, Ti, or W wet etching or oxide etching
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
SNF: Wet Benches
NEMO ID:
wbclean3
Training and Maintenance
Lab Facility:
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Study the relevant operating procedures:
- Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Contact the primary trainer: Uli Thumser
