Aluminum

Chemical Formula:

Al

Aluminum has historically been used in the semiconductor industry to create interconnects within chips. Below is listed the equipment where you can deposit (sorted by deposition method) and etch it, as well as interesting fab documentation regarding your material.

Equipment Tabs

Deposition Equipment

Deposition Equipment
Equipment name & Badger ID	Cleanliness	Location	Material Thickness Range	Approved Materials supplied by Lab
AJA Evaporator aja-evap	Flexible	SNF Exfab Paul G Allen 155A Venice	0.00 - 300.00 nm	Ag Al Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti TiO₂
AJA2 Evaporator aja2-evap	Flexible	SNF Cleanroom Paul G Allen L107	0.00 - 300.00 nm	Ag Al Au Cr Cu Ni Pd Pt Ti
CHA Solutions II Evaporator cha-evap	Flexible	SNF Cleanroom Paul G Allen L107	0.00 - 300.00 nm	Ag Al Au Cr Cu Ni Pd Pt Ti
Intlvac Evaporator Intlvac_evap	Clean Semiclean	SNF Cleanroom Paul G Allen L107	0.00 - 0.50 μm	Al Co Cr Ge Hf Mo Nb Ni Pd Si Ta Ti V W Zr
Lesker Sputter lesker-sputter	Flexible	SNF Exfab Paul G Allen 155A Venice		Ag Al Al₂O₃ AlSi Au Co Cr Cu Fe In_xSn_yO_z Nb Ni Pd Si SiO₂ Ta Ti TiN W
Lesker2 Sputter lesker2-sputter	Semiclean	SNF Cleanroom Paul G Allen L107	1.00 μm	Ag Al Al₂O₃ AlSi Cr Ge In_xSn_yO_z Mo Pd Ru Sc Si SiO₂ Sn Ta Ti TiN W

Etching Equipment

Etch Equipment
Equipment name & Badger ID	Cleanliness	Location	Primary Materials Etched	Other Materials Etched
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	Flexible	SNF Cleanroom Paul G Allen L107	Metals or metal compounds with volatile byproducts Al	GaN
Wet Bench CMOS Metal wbclean3	Semiclean	SNF Cleanroom Paul G Allen L107	Al Ti W
Wet Bench Flexcorr 1 wbflexcorr-1	Flexible	SNF Cleanroom Paul G Allen L107	Metals Al Au Cr Si SiO₂ Resist	GaAs Si3N4 Ti W

Projects

Materials

Aluminum

Equipment Tabs