Overview
PlasmaTherm Metal Etcher (PT-MTL) is an ICP (Inductively Coupled Plasma) etch system configured for the etching of metals and metal-based compounds, such as oxides and nitrides, using Cl or F chemistry, located in the SNF Cleanroom. It is a single wafer etcher for 4 or 6 inch wafers, with a load lock, and is in the “flexible” cleanliness group in SNF
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Other Materials Etched
Process Temperature Range:
Gases
Substrate Sizes
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)
Lab Organization, Location, and NEMO Information
Training and Maintenance
Steps to become a tool user
Become a member of nano@stanford.
Become a member of SNF.
- Study the relevant operating procedures:
- Online training and completing the quiz is required. SeeGo toGo to "nano@stanford" and then to the "PlasmaTherm Etchers Guide" section for watching the video and taking the quiz. For optional overview of plasma etching and how to choose an etcher, go to the "Dry Etching" Section for the three videos on plasma etching principles and "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.
Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or SNF usage to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Contact the primary trainer: Lavendra Mandyam