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Characterization (link to Processing Techniques)
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Materials
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Chlorine
Chemical Formula:
Cl
2
Gases Equipment Tabs
Etch Equipment Table
Equipment name or Badger ID
Partial words okay.
Etch Equipment
Equipment name & Badger ID
Cleanliness
Location
Primary Materials Etched
Other Materials Etched
Gases
AMAT P5000 Etcher
p5000etch
Clean
Clean (Ge)
Semiclean
SNF Cleanroom Paul G Allen L107
Si
Si3N4
SiGe
SiO
2
SiON
C
C
C
dimethylpolysiloxane
poly(p-xylylene)
SiC
Ti
Various C-based
W
WSi
2
PI
Resist
Ti Tungsten
80% He/ 20%O
2
Ar
CF
4
CHF
3
Cl
2
HBr
He
N
2
NF
3
O
2
SF
6
Lam Research TCP 9400 Poly Etcher
lampoly
Clean
Semiclean
SNF Cleanroom Paul G Allen L107
Si
Ge
SiGe
80% He/ 20%O
2
C
2
F
6
CF
4
Cl
2
HBr
He
N
2
O
2
Oxford III-V etcher
Ox-35
Flexible
SNF Cleanroom Paul G Allen L107
GaAs
AlGaN
AlInP
GaN
InGaP
InSb
Ar
BCl
3
CH
4
Cl
2
H
2
HBr
N
2
O
2
SF
6
Oxford Plasma Pro ICP-RIE
Ox-gen
Clean
SNF Cleanroom Paul G Allen L107
BCl
3
CF
4
Cl
2
O
2
SF
6
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
SNF Cleanroom Paul G Allen L107
Metals or metal compounds with volatile byproducts
Al
GaN
Ar
BCl
3
CF
4
CH
4
Cl
2
N
2
O
2
SF
6
Anneal/Oxidation Equipment Table
Equipment name or Badger ID
Partial words okay.
No equipment matches all of the filter criteria you have set above.