Oxford ICP-RIE Atomic Layer Etching (OX-ALE) is an Inductively Coupled Plasma (ICP) etch system designed for high-precision etching of silicon-based materials, III-V semiconductors, and 2D materials. It utilizes chlorine (Cl₂) and fluorine (F) chemistries for atomic layer etching. The tool is housed in the SNF Cleanroom and supports single-wafer processing of 4", 6", and 8" wafers. It features a load-lock system and is classified under the “flexible” cleanliness group within SNF.
PlasmaTherm Oxide Etcher (PT-OX) is an ICP (Inductively Coupled Plasma) etch system configured for the etching of oxide and deep glass/quartz , using F chemistry, located in the SNF Cleanroom. It is a single wafer etcher for 4 or 6 inch wafers, with a load lock, and is in the “flexible” cleanliness group in SNF.