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Hydrogen

Chemical Formula:

H₂

Gases Equipment Tabs

Etch Equipment Table

Etch Equipment
Equipment name & Badger ID	Cleanliness	Location	Primary Materials Etched	Other Materials Etched	Gases
Oxford III-V etcher Ox-35	Flexible	SNF Cleanroom Paul G Allen L107	GaAs	AlGaN AlInP GaN InGaP InSb	Ar BCl₃ CH₄ Cl₂ H₂ HBr N₂ O₂ SF₆
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox	Flexible	SNF Cleanroom Paul G Allen L107	C Si3N4 SiC SiO₂	Various C-based	Ar C₄F₈ CF₄ CHF₃ H₂ He N₂ O₂

Anneal/Oxidation Equipment Table

Deposition Equipment
Equipment name & Badger ID	Cleanliness	Location	Material Thickness Range	Approved Materials supplied by Lab
Aixtron Black Magic graphene CVD furnace aixtron-graphene	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo		C
Aixtron MOCVD - III-N system aix-ccs	Clean (MOCVD)	SNF MOCVD Paul G Allen 213XA	0.00 - 5.00 μm	AlGaN AlN GaN III-N materials InAlN InGaAlN InGaN InN
Aixtron MOCVD - III-V system aix200	Flexible	SNF MOCVD Paul G Allen 213XA	0.00 - 5.00 μm	AlAs AlGaAs GaAs GaP GaPN III-V materials InAs InGaAs InGaAsN
AMAT Centurion Epitaxial System epi2	Clean	SNF Cleanroom Paul G Allen L107	50.00 Å - 3.00 μm	Ge Si SiGe
Fiji 1 ALD fiji1	Semiclean	SNF Cleanroom Paul G Allen L107	1.00 Å - 50.00 nm	Metal oxides Al₂O₃ HfN HfO₂ Pt Ru SiO₂ Ta₂O₅ TaN TiN TiO₂ Various Dielectrics ZrO₂
Fiji 2 ALD fiji2	Flexible	SNF Cleanroom Paul G Allen L107	1.00 Å - 50.00 nm	Metal oxides Al₂O₃ Ga₂O₃ HfN HfO₂ In₂O₃ In_xSn_yO_z MoO₃ Ni_xO_y Pt Ru Si3N4 SiO₂ SnO₂ SrO Ta₂O₅ TiN TiO₂ Various Dielectrics ZrO₂
Fiji 3 ALD fiji3	Flexible	SNF Cleanroom Paul G Allen L107	1.00 Å - 50.00 nm	Al₂O₃ HfO₂ SiO₂ TiO₂ Various Dielectrics
First Nano carbon nanotube CVD furnace cvd-nanotube	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo		C