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Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)

Overview

photo of PT-Ox in SNF Cleanroom

PlasmaTherm Oxide Etcher (PT-OX) is an ICP (Inductively Coupled Plasma) etch system configured for the etching of oxide and deep glass/quartz , using F chemistry,  located in the SNF Cleanroom.  It is a single wafer etcher for 4 or 6 inch wafers, with a load lock, and is in the “flexible” cleanliness group in SNF.

Cleanliness: 

Capabilities and Specifications

Maximum Load: 
1
Notes: 

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Lab Organization, Location, and NEMO Information

Training and Maintenance

Lab Facility: 
Training Charges: 
1.50 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or SNF usage to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
  2. Contact the primary trainer: Lavendra Mandyam