PlasmaTherm Oxide Etcher (PT-OX) is an ICP (Inductively Coupled Plasma) etch system configured for the etching of oxide and deep glass/quartz , using F chemistry, located in the SNF Cleanroom. It is a single wafer etcher for 4 or 6 inch wafers, with a load lock, and is in the “flexible” cleanliness group in SNF.
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)