Project Type: 
E241
Date: 
June 2014 (all day)
Areas of Interest: 
PECVD SiNx stress, Nanosphere etching
Report: 
SiNx PECVD and Nanostructure Etching Recipe Development- Final Report
Processing Technique (former Function and Method): 
Plasma Enhanced (PE) CVD
Dry Etching
Researchers and (Mentors): 
Yusi Chen and Muyu Xue
List of Important Equipment: 
PlasmaTherm Shuttlelock PECVD System (ccp-dep)
Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)
Presentation: 
SiNx Deposition and Etching recipe Development- Final Presentation