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      • Resist Exposure Equipment
    • Wet Chemical Processing (link to Processing Techniques)

Equipment

  • Equipment Name Table
  • Characterization (link to Processing Techniques)
  • CVD (link to Processing Techniques)
  • Doping (link to Processing Techniques)
  • Dry Etch (link to Processing Techniques)
    • RIE Etchers
    • Vapor Etchers
    • CCP Etchers
    • Downstream Plasma Etchers
    • ICP Etchers
    • Legacy Dry Etch Equipment Overview
  • Metallization (link to Processing Techniques)
  • Oxidation and Annealing (link to Processing Techniques)
  • Photolithography (link to Processing Techniques)
  • Wet Chemical Processing (link to Processing Techniques)

Function and Method(s)

Function and Method(s): 
Dry Etching

Equipment Used

Lam Research TCP 9400 Poly Etcher (lampoly)
Matrix Plasma Resist Strip (matrix)
MRC Reactive Ion Etcher (mrc)
Oxford Dielectric Etcher (oxford-rie)
Oxford III-V etcher (Ox-35)
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Plasma Therm Versaline LL ICP Dielectric Etcher (PT-Ox)
Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL)
Plasmaetch PE-50 (plasma-etch)
Xactix Xenon Difluoride Etcher (xactix)

Dry Etch Equipment Overview

Source: 
Dry Etch Equipment Overview
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Dry Etch Equipment Overview

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