Skip to content Skip to navigation

Xactix Xenon Difluoride Etcher (xactix)


The Xactix e-1 is a XeF2 (xenon difluoride) isotropic silicon etcher.  XeF2 is a vapor phase etch, which exhibits nearly very high selectivity of silicon to photo-resist, silicon dioxide, silicon nitride and aluminum.   The e-1 Series can be used to etch silicon wafers, up to 6” in diameter, wafer pieces, die, or other structure into the etch chamber.  Details of the process sequence are controlled and captured by the control software. The etch progress can be monitored through the transparent chamber lid.


Processing Technique(s)

Capabilities and Specifications

Maximum Load: 

Isotropic Si etching; can be used for backside Si removal on small pieces

Lab Organization, Location, and NEMO Information

NEMO Area: 
SNF: Dry Etching

Training and Maintenance

Lab Facility: 
Training Charges: 
0.50 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Study the relevant operating procedures:
  2. Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
  3. Contact the primary trainer: Lavendra Mandyam

Operating Instructions