For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
CO2 drying after release of micromachined devices
Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists
Direct Write
Two programs: Singe and HMDS prime or Singe only. No Resist allowed!
1:1 Contact Aligner. Backside align, including IR.
1:1 Contact Aligner. Backside align.
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
