CHA Solutions II Evaporator (cha-evap)
Overview
The CHA e-beam evaporator is a thin film metal deposition tool. It will be used exclusively for the deposition of metals, with a particular focus on the most evaporated metals at SNF(Ti, Au, Cr, Al, Ni, Pt, Pd, Ag, Cu, etc..). This tool can run a maximum of 15 four-inch substrates and 3 Six-inch substrates in planetary configuration. Deposition rate is PID controlled, with automatic shutter closure at the defined end thickness.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Lab Supplied Materials
Material Thickness Range: 0.0 - 300.0 nm
Substrate Type
Substrate Sizes
Maximum Load:
4"x15 or 6"x3 wafers or pieces
Notes:
For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
SNF: Metallization
NEMO ID:
cha-evap
Training and Maintenance
Lab Facility:
Training Charges:
1.00 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Study the relevant operating procedures:
- Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or SNF usage to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Contact the primary trainer: Neel Mehta
Notes:
One shadowing session and a training is required. Training sessions are held 3pm Tuesdays and Thursdays; sign up through NEMO. Sessions limited to 4 attendees.
