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Evaporation

Evaporation is a common method of thin-film deposition. It involves two basic processes: a hot source material evaporates and condenses on the substrate.

Technique Tabs

Main Tab

Processing Techniques	Equipment name & NEMO ID	Teaser Blurb	Cleanliness	Location
Evaporation	AJA Evaporator aja-evap		Flexible	SNF Exfab Paul G Allen 155A Venice
Evaporation	AJA2 Evaporator aja2-evap	This E-beam evaporator can evaporate a variety of metals (no oxides) onto your substrates. It has an integrated ion mill for substrate precleaning.	Flexible	SNF Cleanroom Paul G Allen L107
Evaporation	CHA Solutions II Evaporator cha-evap	cha-evap is a non-load locked e-beam evaporator designed for higher throughput.	Flexible	SNF Cleanroom Paul G Allen L107
Evaporation	Intlvac Evaporator Intlvac_evap		Clean, Semiclean	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & NEMO ID	Cleanliness	Materials Lab Supplied	Material Thickness Range	Substrate Size	Maximum Load (number of wafers)	Notes
Evaporation	AJA Evaporator aja-evap	Flexible	Ag Al Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti Titania	0.00 - 300.00 nm	Pieces 2" 3" 4" 6"	4"x3 or 6"x1 wafers or pieces	For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Evaporation	AJA2 Evaporator aja2-evap	Flexible	Ag Al Au Cr Cu Ni Pd Pt Ti	0.00 - 300.00 nm	Pieces 2" 3" 4" 6"	4"x3 or 6"x1 wafers or pieces	For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
Evaporation	CHA Solutions II Evaporator cha-evap	Flexible	Ag Al Au Cr Cu Ni Pd Pt Ti	0.00 - 300.00 nm	Pieces 2" 3" 4" 6"	4"x15 or 6"x3 wafers or pieces	For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
Evaporation	Intlvac Evaporator Intlvac_evap	Clean, Semiclean	Al Co Cr Ge Hf Nb Ni Pd Si Ta Ti V W Zr Moly	0.00 - 0.50 μm	Pieces 2" 3" 4" 6"	12 4 inch wafers, 2 6 inch wafers