Evaporation is a common method of thin-film deposition. It involves two basic processes: a hot source material evaporates and condenses on the substrate. 

Processing Technique Equipment name & NEMO ID Cleanliness Materials Lab Supplied Material Thickness Range Substrate Size Maximum Load (number of wafers) Notes Stylus Tip Radius
Evaporation AJA Evaporator
aja-evap 		Flexible
0.00 - 300.00 nm
4"x3 or 6"x1 wafers or pieces

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Evaporation AJA2 Evaporator
aja2-evap 		Flexible
0.00 - 300.00 nm
4"x3 or 6"x1 wafers or pieces

For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
Evaporation CHA Solutions II Evaporator
cha-evap 		Flexible
0.00 - 300.00 nm
4"x15 or 6"x3 wafers or pieces

For more than 300nm deposition, please contact Neel Mehta <nmehta26@stanford.edu> in advance
Evaporation Intlvac Evaporator
Intlvac_evap 		Clean, Semiclean
0.00 - 0.50 μm
12 4 inch wafers, 2 6 inch wafers