The AJA e-beam evaporator can be used to directionally deposit various metals. Controllably evaporate a variety of materials, with automatic shutter closing at the defined end thickness. Evaporate Ti, SiO2, Al2O3, Au, Fe, Cr, Ni, Ag, Pt, Al, Pd, NiO, Cu, TiO2, Nb2O5, Ge, Hf, et al. Please check the up-to-date list in Badger comments. Evaporate onto pieces, up to 3 4" wafers, or a 6" wafer, which are transferred into the chamber via a load lock.
For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
One shadowing session and a training with tool owner are required. Training sessions are scheduled for 10:30am on the 2nd Wednesday of the month. Please join if you are available. Review the training calendar, or contact the tool owner when confirming the date