Project Type: 
E241
Date: 
December 2017 (all day)
Areas of Interest: 
Ultra-smooth metal films
Report: 
Ultra-smooth platinum films for biosensing applications- Final Report
Processing Technique (former Function and Method): 
Deposition
Wafer Polishing
Researchers and (Mentors): 
Charmaine Chia, (Michelle Rincon)
List of Important Equipment: 
Heidelberg MLA 150 (heidelberg)
CMP GnP POLI-400L (cmp)
AJA Evaporator (aja-evap)
Lesker Sputter (lesker-sputter)
Presentation: 
Preparation of Ultra-Smooth Platinum Films- Final Presentation