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CMP GnP POLI-400L (cmp)



The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4” wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surfaces, and to smooth surface roughness.


Processing Technique(s)

Lab Organization, Location, and NEMO Information

Lab Organization: 
NEMO Area: 
nSiL: 159 Capitola

Training and Maintenance

Lab Facility: 
Training Charges: 
1.50 hours
Primary Trainer: 
Primary Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Study the relevant operating procedures:
  2. Shadow other labmembers who are using the tool. Make sure to get hands on experience with set up and clean up since these are critical to proper tool function.
  3. Contact the primary trainer: Graham Ewing

Operating Instructions