Project Type: 
E241
Date: 
December 2014 (all day)
Areas of Interest: 
MEMS, release strategies
Report: 
Surface Micromachining Method for Releasing a Range of Micron-Scale Membranes- Final Report
Processing Technique (former Function and Method): 
Atomic Layer Deposition (ALD)
Reactive Ion Etching (RIE)
Wafer Polishing
Researchers and (Mentors): 
Martin Winterkorn, Anup Dadlani, Yongmin Kim, (J Provine), (Michelle Rincon)
List of Important Equipment: 
Fiji 1 ALD (fiji1)
Fiji 2 ALD (fiji2)
Fiji 3 ALD (fiji3)
CMP GnP POLI-400L (cmp)
Xactix Xenon Difluoride Etcher (xactix)
Sensofar S-neox (s-neox)
ASML PAS 5500/60 i-line Stepper (asml)
Presentation: 
Surface micromachining method for releasing a range of micron-scale membranes- Final Presentation