The ASML PAS 5500/60 stepper is an i-line system with automatic 100mm* wafer cassette processing capability. Using 365nm near-UV light this stepper is capable of a minimum feature size of 450nm and alignment between lithographic layers of 90nm. The stepper uses 5X reduction imaging allowing a maximum die area of 18mm by 22.4mm per exposure.
*150mm capable with advanced notice. Requires approval and additional conversion fee
5:1 reducing stepper
Job Writing: 2 hours and Tool Training: 2 hours