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Vertical Semiconductor Blades
Project Type:
E241
Date:
June 2015
Areas of Interest:
MOCVD, ASML, double exposure, JEOL, InSb, Ox III-V
Report(s):
Vertical Semiconductor Blades- Final Report
Processing Technique (former Function and Method):
Reactive Ion Etching (RIE)
Photolithography
Researchers and (Mentors):
Martin Winterkorn, Anup Dadlani, Karen Kim, (J Provine)
List of Important Equipment:
ASML PAS 5500/60 i-line Stepper (asml)
Aixtron MOCVD - III-N system (aix-ccs)
Oxford III-V etcher (Ox-35)
Presentation(s):
Vertical Quantum Confinement Structures- Final Presentation
Materials
III-V materials (III-V materials)