Reactive ion etchers are parallel plate, capacitively coupled plasma etchers wherein the substrate sits on the powered electrode. An RF power, in most cases at 13.56MHz, is applied to the powered electrode. The powered electrode area is typically smaller than the grounded electrode area. Gases that are fed into the chamber are ioized and produce a gaseous mixture of neutral and ionized species. The positively charged species accelerate toward the biased electrode where the substrate is placed and causes the etching of the substrate. It is also called ion assisted etching as neutrals also participate in the etching process.
| Processing Techniques | Equipment name & NEMO ID | Teaser Blurb | Cleanliness | Location |
|---|---|---|---|---|
| Reactive Ion Etching (RIE) |
MRC Reactive Ion Etcher mrc |
The MRC is a general purpose, plasma reactive ion etching system, used to etch a variety of materials, including metals, oxides, nitrides, silicons, and some organic films. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Reactive Ion Etching (RIE) |
Oxford Dielectric Etcher oxford-rie |
Oxford-rie is to etch di-electric materials with fluorine based etch gases and oxygen. |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Reactive Ion Etching (RIE) |
Plasmaetch PE-50 plasma-etch |
The Plasmaetch PE-50 is located in Venice, and is used primarily for surface treatment, for example with PDMS. |
Flexible | SNF Exfab Paul G Allen 155A Venice |
| Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal |
Samco PC300 Plasma Etch System samco |
The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch or Downstream plasma modes |
Flexible | SNF Paul G Allen L107 Cleanroom |