Samco PC300 Plasma Etch System (samco)
Overview
The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch or Downstream plasma modes. There are 3 gases that are plumbed to the tool: Gas1: O2, Gas2: CF4, and Gas3: SF6. The characterized etches allowed in this tool include O2 descum, PhotoResist strip, Silicon-Nitride etch, isotropic silicon etch.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Other Materials Etched
Process Temperature Range:
20 ºC
Gases
Substrate Type
Substrate Sizes
Maximum Load:
Four 4" wafers or two 6" wafers and one 8" wafer
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
SNF: Dry Etching
NEMO ID:
samco
Training and Maintenance
Lab Facility:
Training Charges:
0.50 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Study the relevant operating procedures:
- Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or SNF usage to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Contact the primary trainer: Lavendra Mandyam
