Dry resist removal, called Ashing, uses O2 plasma to react with the resist to remove it from the substrate.
The asher you will need will depend on the materials on your substrate as well as your substrate itself in addition cleanliness category of your sample. (For more about the cleanliness categories, please visit the Cleanliness (previously Contamination) Groups page).
| Processing Techniques | Equipment name & NEMO ID | Teaser Blurb | Cleanliness | Location |
|---|---|---|---|---|
| Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Gasonics Aura Asher gasonics |
The Gasonics Aura Asher is an automated down stream microwave plasma system used for stripping photoresist of 4 inch wafers in the 'clean' cleanliness group. |
Clean, Semiclean | SNF Paul G Allen L107 Cleanroom |
| Downstream/Remote Plasma Resist Removal, Downstream/Remote Plasma Etching |
Matrix Plasma Resist Strip matrix |
The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination of oxygen plasma, high power, higher pressure and a heated chuck (platen). |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Plasma Mode Etching, Reactive Ion Etching (RIE), Downstream/Remote Plasma Resist Removal |
Samco PC300 Plasma Etch System samco |
The SAMCO etcher is a multifunctional etcher that can operate in either the RIE, plasma etch or Downstream plasma modes |
Flexible | SNF Paul G Allen L107 Cleanroom |
| Dry Resist Removal, Dry Etching |
Technics Asher technics |
Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma |
Flexible | SNF Paul G Allen L107 Cleanroom |