Overview
The Gasonics Aura Asher is an automated downstream microwave plasma system used for stripping photoresist of clean 4 inch wafers which are in the 'clean' cleanliness group. The system generates a plasma of oxygen and nitrogen in a reaction chamber. This reactive mixture flows downstream to the process chamber where it reaches a state of “afterglow,” where it is highly reactive and no longer electrically active or damaging to the wafer surface. The dissociated oxygen chemically reacts with the photoresist effectively burning the resist off the wafer.
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Other Materials Etched
Process Temperature Range:
Gases
Substrate Type
Substrate Sizes
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.
Lab Organization, Location, and NEMO Information
Training and Maintenance
Steps to become a tool user
Become a member of nano@stanford.
Become a member of SNF.
- Study the relevant operating procedures:
Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or SNF usage to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Contact the primary trainer: Lavendra Mandyam