Equipment Tables
| Equipment name & NEMO ID | Training Required & Charges | Cleanliness | Location | Notes |
|---|---|---|---|---|
|
Gasonics Aura Asher gasonics |
Resist Removal Dry Gasonics Training | Clean, Semiclean | SNF Paul G Allen L107 Cleanroom |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps. |
|
Lam Research TCP 9400 Poly Etcher lampoly |
Lam Research TCP 9400 Poly Etcher Training | Clean, Semiclean | SNF Paul G Allen L107 Cleanroom |
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides. |
|
Matrix Plasma Resist Strip matrix |
Matrix Plasma Resist Strip Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
|
MRC Reactive Ion Etcher mrc |
MRC Reactive Ion Etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode |
|
Oxford Dielectric Etcher oxford-rie |
Oxford Dielectric Etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
|
Oxford III-V etcher Ox-35 |
Oxford III-V etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only. |
|
Oxford Plasma Pro ICP-RIE Ox-gen |
Ox-gen etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom | |
|
Oxford Plasma Pro ICP-RIE ALE Ox-ALE |
Oxford Plasma Pro ICP-RIE ALE Training | Flexible | SNF Paul G Allen L107 Cleanroom | |
|
Oxford Plasma Pro ICP-RIE Ox Ox-Ox |
Oxford Plasma Pro ICP-RIE Ox Training | Clean | SNF Paul G Allen L107 Cleanroom | |
|
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching |
|
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Plasma Therm Versaline LL ICP Dielectric Etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
|
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Plasma Therm Versaline LL ICP Metal Etcher Training | Flexible | SNF Paul G Allen L107 Cleanroom |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
|
Samco PC300 Plasma Etch System samco |
Samco Training | Flexible | SNF Paul G Allen L107 Cleanroom | |
|
SPTS uetch vapor etch uetch |
SPTS uetch vapor etch Training | "All" | SNF Paul G Allen L107 Cleanroom |
Pieces need a carrier wafer; Isotropic Etching |
|
Technics Asher technics |
Technics Asher Training | Flexible | SNF Paul G Allen L107 Cleanroom | |
|
Xactix Xenon Difluoride Etcher xactix |
Xactix Xenon Difluoride Etcher Training | "All" | SNF Paul G Allen L107 Cleanroom |
Isotropic Si etching; can be used for backside Si removal on small pieces |