Overview
Lampoly is a Transformer Coupled Plasma (TCP) etcher, generates a uniform, high density plasma for selective etching of silicon and polysilicon. It has two independent 13.56 MHz RF power supplies which deliver high and low power to the upper and lower electrodes, respectively. A high density discharge is generated by the higher-power RF supply by inductive coupling of a planar source coil to the gas in the chamber.; Clean category; for polysilicon and single crystal Silicon etches; maximum etch depth 3um.
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Other Materials Etched
Substrate Type
Substrate Sizes
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.
Lab Organization, Location, and NEMO Information
Training and Maintenance
Steps to become a tool user
Become a member of nano@stanford.
Become a member of SNF.
- Study the relevant operating procedures:
The following step Online Course is optional:
Online Course for general information about the online training. Go to Online Nano Course Login to log in directly to the course.
Go to "nano@stanford" and then to the "Dry Etching" section for the three videos on plasma etching principles and to "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment.Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or SNF usage to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Contact the primary trainer: Lavendra Mandyam