PROM Request Title: 
Wafer scribe and etch procedure to go into clean etch tools
PROM Request Summary: 
Introduce jig and create process flow to dice a wafer into pieces and be allowed into clean etch tools without addtional cleans.
PROM Date: 
02/19/2019 (all day)
PROM Decision: 
Approved.
Link to PROM Request and supporting documentation: 
Wafer scribe and etch procedure to go into clean etch tools
Equipment List: 
Epilog Fusion M2 Laser Cutter (lasercutter)
Lam Research TCP 9400 Poly Etcher (lampoly)