Use of Crystal Bond 509-HMP in Lampoly
PROM Request Title:
Use of Crystal Bond 509-HMP in Lampoly
PROM Request Summary:
Request to use Crystal Bond 509 to mount chips on wafer in Lampoly etcher.
PROM Date:
07/15/2014
PROM Decision:
Conditional approval. Crystal Bond use requires additional characterization and procedure definition. Alternatives proposed.
Link to PROM Request and supporting documentation:
Equipment List:
