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Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)


photo of PT-DSE in SNF Cleanroom

PT-DSE is an ICP (Inductively Coupled Plasma) etch system configured for Deep Si etches using alternate gas technique similar to Bosch process.


Capabilities and Specifications

Maximum Load: 

Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching

Lab Organization, Location, and NEMO Information

NEMO Area: 
SNF: Dry Etching

Training and Maintenance

Lab Facility: 
Training Charges: 
1.50 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
  2. Contact the primary trainer: Lavendra Mandyam