Fabrication of an Etched Silicon Microdissection Platform with Applications in Organotypic Culture and Personalized Immunotherapy Testing

Project Type:

E241

Date:

March 2020 (all day)

Areas of Interest:

Silicon patterning for tissue cutting

Report:

F19- Fabrication of an Etched Silicon Microdissection Platform with Applications in Organotypic Culture and Personalized Immunotherapy Testing

W20- Fabrication of an Etched Silicon Platform with Applications in Uniform Dissection of Biological Samples Final Report

Processing Technique (former Function and Method):

Inductively Coupled Plasma Etching (ICP)

Researchers and (Mentors):

Nicolas Castaño, Seth Cordts, Saisneha Koppaka (Usha Raghuram), (Tony Ricco), (Mark Zdeblick)

List of Important Equipment:

Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)

Nano Nugget:

SOP- Silicon Oxide Hardmask for Si Etching in PT-DSE

Step-by-step procedures and processing tips for fabrication of an SiOx hardmask for deep silicon etch in the SNF.

Read more about SOP- Silicon Oxide Hardmask for Si Etching in PT-DSE

Tips- Using Keyence for X-sectional Imaging

Tips for using the Keyence to image cross sections of wafer pieces. This can be used as a quick check before X-SEM.

Read more about Tips- Using Keyence for X-sectional Imaging

SOP- Fabrication of an Etched Silicon Platform with Applications in Uniform Dissection of Biological Samples

This document contains standard operating procedures (SOPs) for the following processes: 1.Fabrication of oxide hard mask for deep silicon etching. 2.Tapered etch method for blade formation using PT-DSE 3.Through-hole etching using PT-DSE

Read more about SOP- Fabrication of an Etched Silicon Platform with Applications in Uniform Dissection of Biological Samples

Presentation:

MicroTissue Dicer- Fall Quarter Final Presentation

Materials

Silicon