Project Type: 
E241
Date: 
December 2015 (all day)
Areas of Interest: 
Optimizing Isotropic etching in the PT-DSE
Report: 
Optimization of Silicon Isotropic Plasma Etch in PT­DSE for GOPHER Process- Final Report
Processing Technique (former Function and Method): 
Reactive Ion Etching (RIE)
Researchers and (Mentors): 
Andrew Ceballos, (Usha Raghuram)
List of Important Equipment: 
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Presentation: 
Optimization of Isotropic Plasma Etch in PT-DSE for GOPHER Process- Final Presentation