Variable Trench Optimization for DRIE of SOI in PT-DSE

Project Type:

E241

Date:

June 2015 (all day)

Areas of Interest:

DRIE, SOI, PT-DSE

Report:

Variable Trench Optimization for DRIE of SOI in PT-DSE- Final Report

Processing Technique (former Function and Method):

Reactive Ion Etching (RIE)

Researchers and (Mentors):

Ian Flader, Yunhan Chen, (Usha Raghuram)

List of Important Equipment:

Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)

Presentation:

Variable Trench Optimization for DRIE of SOI in PT-DSE- Final Presentation