Heidelberg MLA 150 (heidelberg)

The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a mask resulting in a significantly shorter prototyping cycle. It offers topside alignment and backside alignment with high accuracy, and a light source which generates sufficient dose to expose even thick and less sensitive resists. The sample size range allowed on MLA150 are 5 mm  X 5 mm to 150 mm X 150 mm and allowed thickness range from 100 um - 6 mm. MLA 150 provides for flexible change of pattern, distortion compensation and other software corrections. For backside alignment, the substrate needs to be big enough that the alignment marks can be seen through the slots on the chuck. Please refer to the chuck dimensions on page 69 of the user guide attached below. Currently, the exposure wavelength is 405 nm in the tool. Please use resists that can be exposed at 405 nm or higher wavelengths. Please contact Swaroop Kommera if you have any questions regarding the substrates or resists that can be used. The system can produce structures down to 1 µm. The alignment accuracy can be as good as 250 nm under optimized conditions.

Once you are trained on the tool, please join the tool discussion list. The instruction and the lists are located at https://snfexfab.stanford.edu/snf/join/discussion-lists