This AJA e-beam evaporator is used to directionally deposit various metals (Ti, Au, Cr, Al, Ni, Pt, Pd, Ag, Cu, etc..). Deposition rate is PID controlled, with automatic shutter closure at the defined end thickness. This tool also has an integrated Ar ion mill, which can be used to clean substrate surface prior to deposition. Accomodates up to three 4" wafers, one 6" wafer, or wafer pieces, which are transferred into the chamber via a load lock. SNF staff try to minimize target changes on this tool, so please direct non-standard deposition metal requests to the first AJA. Oxide deposition is not allowed in this tool. An up-to-date list of loaded deposition targets is maintained on NEMO.
For more than 300nm deposition, please contact Gabe Catalano <gcatalano@stanford.edu> in advance
One shadowing session and a training with tool owner are required. Training sessions are held 3pm Weds; sign up through NEMO. Sessions limited to 5 attendees. Review the training calendar on NEMO, or contact the tool owner when confirming the date.