Overview
Lesker2 is a load locked single wafer metal sputter providing semi-clean processing options for semi-clean compatible materials. The eight gun magnetron Lesker is classified as semi-clean and provides non-directional thin film (< 1 um)
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Lab Supplied Materials
Material Thickness Range:
1.0
μm
Process Temperature Range:
°C - 800 °C
Substrate Type
Substrate Sizes
Maximum Load:
one 4 inch wafer, one 6 inch wafer
Notes:
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
NEMO ID:
lesker2-sputter
Training and Maintenance
Lab Facility:
Training Charges:
1.00 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
Become a member of nano@stanford.
Become a member of SNF.
- Study the relevant operating procedures:
Check the NEMO Training Dashboard for upcoming training sessions (login required).