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DISCO Wafer Saw (DISCO wafersaw)


Capable of cutting silicon, glass, quartz, Sapphire, and III-V substrates up to 8" circles.  


Processing Technique(s)

Capabilities and Specifications

Material Thickness Range: μm mm
Maximum Load: 
1x4", 1x6" or 1x8" wafer, or pieces

Lab Organization, Location, and NEMO Information

Lab Organization: 
NEMO Area: 
nSiL: 159 Capitola
DISCO wafersaw

Training and Maintenance

Lab Facility: 
Training Charges: 
2.00 hours
Primary Trainer: 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Study the relevant operating procedures:
  2. Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
  3. You need to shadow twice on the tool.
  4. Contact the primary trainer: Swaroop Kommera

Operating Instructions