DISCO Wafer Saw (DISCO wafersaw)
Overview
Capable of cutting silicon, glass, quartz, Sapphire, and III-V substrates up to 8" circles.
Cleanliness:
Capabilities and Specifications
Material Thickness Range: μm mm
Substrate Type
Substrate Sizes
Maximum Load:
1x4", 1x6" or 1x8" wafer, or pieces
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
nSiL: 159 Capitola
NEMO ID:
DISCO wafersaw
Training and Maintenance
Lab Facility:
Training Charges:
2.00 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Study the relevant operating procedures:
- Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- You need to shadow twice on the tool.
- Contact the primary trainer: Swaroop Kommera
