PROM Request Title: 
Use of Copper Mask in SF6/O2 chemistry in PT-MTL
PROM Request Summary: 
Request to use copper as a masking layer for etch in PT-MTL using SF6/O2 chemistry.
PROM Date: 
06/10/2014 (all day)
PROM Decision: 
Rejected. Risks to both equipment and subsequent users deemed too high. Efforts to find alternative path ongoing.
Link to PROM Request and supporting documentation: 
Use of Copper Mask in SF6/O2 chemistry in PT-MTL
Equipment List: 
Plasma Therm Versaline LL ICP Metal Etcher (PT-MTL)