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Wet Bench Clean_res-piranha (wbclean_res-piranha)


The wbclean_res-piranha is part of the Wet Bench Clean_-res-piranha-hf-hotphos. This bench (semi-automated) is part of the Clean Cleanliness Group for 3", 4", and 6" Si, SiGe, and quartz substrates and is primarily used for stripping photoresist, removing scribe dust and wet oxide etching. Wafers may not contain or have ever contained any metals, nor been exposed to equipment which may pose this contamination risk. This bench contains two hot pots for 90% sulfuric acid/hydrogen peroxide ("piranha") for stripping resist, two Teflon tanks containing 50:1 HF, 20:1 BOE, or 6:1 BOE for etching oxide, one hot pot for phosphoric acid, three automatic dump rinsers and two spin/rinse dryers.


Capabilities and Specifications


Resist will be removed

Lab Organization, Location, and NEMO Information

NEMO Area: 
SNF: Wet Benches

Training and Maintenance

Lab Facility: 
Training Charges: 
2.25 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 
Backup Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
  2. During the shadowing, use the Wet Bench Checklist.
  3. For upcoming training check the Training dashboard (login required).
  4. Contact the primary trainer: Uli Thumser

covered in wbclean-1 and-2