Wet Bench Clean_res- hotphos (wbclean_res-hotphos)
Overview
The wbclean_res-hotphos is part of the Wet Bench Clean_-res-piranha-hf-hotphos. This bench (semi-automated) is part of the Clean Equipment Group for 3", 4", and 6" Si, SiGe, and quartz substrates and can only be used for wet silicon nitride etching. Wafers may not contain or have ever contained any metals, nor been exposed to equipment which may pose this contamination risk. This part of the bench contains one hot pot for phosphoric acid and one automatic dump rinser.
Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Substrate Type
Substrate Sizes
Notes:
Resist should have been removed
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
SNF: Wet Benches
NEMO ID:
wbclean_res-hotphos
Training and Maintenance
Lab Facility:
Training Charges:
2.25 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
-
Become a member of SNF.
- Study the relevant operating procedures:
- Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- During the shadowing, use the Wet Bench Checklist.
- For upcoming training check the Training dashboard (login required).
- Contact the primary trainer: Uli Thumser
Notes:
covered in wbclean-1 and-2
