Decontamination cleans are used to remove trace metals and particles from substrates. This step is required for post processing of wafers and pieces that have gone through KOH-etching, chemical-mechanical polishing (cmp), and the wafer saw. For more about the contamination categories, please visit the Cleanliness (previously Contamination) Groups page.
| Processing Techniques | Equipment name & NEMO ID | Teaser Blurb | Cleanliness | Location |
|---|---|---|---|---|
| Decontamination, Wet Chemical Processing |
Wet Bench Decontamination wbdecon |
Decontamination of 3" or 4" silicon, quartz, or silicon germanium wafers after KOH, wafersaw, or cmp using SC2 before being allowed back into the clean equipment group. |
Clean | SNF Paul G Allen L107 Cleanroom |
| Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Manual wet etching of non-standard materials using only SNF approved acids or bases. Hot plate available. GaAs allowed in personal labware only. |
Flexible | SNF Paul G Allen L107 Cleanroom |