Decontamination cleans are used to remove trace metals and particles from substrates. This step is required for post processing of wafers and pieces that have gone through KOH-etching, chemical-mechanical polishing (cmp), and the wafer saw. For more about the contamination categories, please visit the Cleanliness (previously Contamination) Groups page.
| Processing Technique | Equipment name & NEMO ID | Cleanliness | Chemicals | Primary Materials Etched | Other Materials Etched | Substrate Size | Notes | Stylus Tip Radius |
|---|---|---|---|---|---|---|---|---|
| Decontamination, Wet Chemical Processing |
Wet Bench Decontamination wbdecon |
Clean |
KOH or wafersaw or post-cmp decontamination |
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| Decontamination, Metal Clean, Piranha Cleaning, Wet Resist Removal, Acid or Base Wet Etching, Aluminum and Titanium and Tungsten Wet Etching, Silicon Wet Etching, Silicon Oxide Wet Etching, Wet Chemical Processing |
Wet Bench Flexcorr 1 wbflexcorr-1 |
Flexible |
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only. |