Cleanliness:
Processing Technique(s)
Capabilities and Specifications
Primary Materials Etched
Primary Materials Etched:
Process Temperature Range:
20 °C - 60 °C
Substrate Type
Substrate Sizes
Maximum Load:
25 4 inch wafers
Notes:
Wet Resist Removal: SRS-100 or PRS1000
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
NEMO ID:
wbresstrip-1
Training and Maintenance
Lab Facility:
Training Charges:
0.75 hours
Primary Trainer:
Primary Maintenance:
Backup Maintenance:
Steps to become a tool user
Become a member of nano@stanford.
Become a member of SNF.
- Study the relevant operating procedures:
Shadowing is required. Contact a qualified lab member of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or SNF usage to find a qualified user. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool. Please follow the instructions on this form: Shadowing at SNF
- Contact the primary trainer: Uli Thumser