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Oven Bake

Technique Tabs

Main Tab

Processing Techniques	Equipment name & NEMO ID	Teaser Blurb	Cleanliness	Location
Oven Bake	Oven (White) white-oven		Flexible	SNF Cleanroom Paul G Allen L107
Resist Post Bake	Oven 110°C post-bake oven110	The 110°C Oven bakes the wafers with resist at 110ºC after the development, called post-bake.	All	SNF Cleanroom Paul G Allen L107
Resist Prebake	Oven 90°C prebake oven90	The 90°C Oven is the 90°C prebake oven. It is used to bake wafers after resist coating.	All	SNF Cleanroom Paul G Allen L107
Oven Bake	Oven BlueM 200°C to 430°C bluem	The BlueM oven is for 200°C to 437°C temperature bakes, i.e. polyimide.	Flexible	SNF Cleanroom Paul G Allen L107
Resist UV Cure	Ultraviolet Photoresist Cure uvcure	Ultraviolet Photoresist Cure, primary wavelength is 254 nm.	All	SNF Cleanroom Paul G Allen L107

Detail Tab

Processing Technique	Equipment name & NEMO ID	Cleanliness	Exposure Wavelength	Substrate Size	Process Temperature Range	Notes
Oven Bake	Oven (White) white-oven	Flexible		Pieces 2" 3" 4" 6"	0 °C - 200 °C	For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Resist Post Bake	Oven 110°C post-bake oven110	All		Pieces 2" 3" 4" 6"	110 ºC	Bakes wafers with resist after the development, called post-bake.
Resist Prebake	Oven 90°C prebake oven90	All		Pieces 2" 3" 4" 6"	90 ºC	Bakes wafers after resist coating.
Oven Bake	Oven BlueM 200°C to 430°C bluem	Flexible		Pieces 2" 3" 4" 6"	0 °C - 430 °C	Convection in N2. Cure. Programmable.
Resist UV Cure	Ultraviolet Photoresist Cure uvcure	All	254 nm