Skip to content Skip to navigation

DISCO Backgrinder (disco-backgrind)


DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. This tool can process sample pieces to 8 inch wafers. Reproducibility is less than 1.5um across an 8 inch surface and surface roughness possible is better than 150nm.


Processing Technique(s)

Lab Organization, Location, and NEMO Information

Lab Organization: 
NEMO Area: 
nSiL: 159 Capitola

Training and Maintenance

Lab Facility: 
Training Charges: 
2.00 hours
Primary Trainer: 
Backup Trainer(s): 
Primary Maintenance: 

Steps to become a tool user

  1. Become a member of SNF.
  1. Study the relevant operating procedures:
  2. Contact the primary trainer: Saeed Nejad

Operating Instructions