Overview
DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. This tool can process sample pieces to 8 inch wafers. Reproducibility is less than 1.5um across an 8 inch surface and surface roughness possible is better than 150nm.
Cleanliness:
Processing Technique(s)
Lab Organization, Location, and NEMO Information
Lab Organization:
Location:
NEMO Area:
NEMO ID:
disco-backgrind
Training and Maintenance
Lab Facility:
Training Charges:
1.50 hours
Primary Trainer:
Backup Trainer(s):
Primary Maintenance:
Steps to become a tool user
Become a member of nano@stanford.
Become a member of SNF.
- Study the relevant operating procedures:
- Contact the primary trainer: Saeed Nejad